How Does it Work?
Mr. Tarczynski has been designing and documenting this concept for quite some time. He has several “mock-up” drawings of the product, which have provided the inventor with a sense of how the concept will appear once brought into production. This is beneficial for making any necessary modifications and revisions for improvements; thus promoting a more satisfactory and overall accommodating product.
As currently designed in the technical drawings and 3-D models, the invention has unique features not presently available in the marketplace. Although the system has not yet been engineered and is still in the 3-D developmental stages, an explanation of possible functionality is as follows:
The Super Integrated Circuit Chip Semiconductor Device has a superior ceramic outer casing and houses a chip pad and multiple layers of Heterodiamond Substrates with bonding wire that contains an Au—Cu—Ag alloy, including 5-40% Ag by weight in Cu having a purity of 99.999% or greater; at least one element of a first group consisting of Pd, Rh, Pt, and Ir in an amount of about 50-10,000 ppm by weight; at least one element of a second group consisting of B, Be, and Ca in an amount of about 1-50 ppm by weight; at least one element of a third group consisting of P, Sb, and Bi in an amount of 1-50 ppm by weight; and at least one element of a fourth group consisting of Mg, Ti, Zn and Sn in an amount of about 5-50 ppm by weight. Boron Carbide, used for the outer casing, is one of the lightest, hardest, chemically inert man-made materials available in commercial quantities that has a finite melting point low enough to permit its relatively easy fabrication into shapes.
The unique properties of Boron Carbide include high hardness, chemical inertness and a high neutron absorbing cross section. Heterodiamond is confirmed to have both the highest hardness of diamonds and the excellent heat resistance of cubic BN. Additionally, it shows promise as a low dielectric constant material with good mechanical strength, suitable to be used in new CMOS technologies. For optical applications, the deposition of BCN coatings on polymers is a promising method for protecting the polymer surface against wear and scratching. BCN films have high optical transparency and can be used as mask substrates for X-ray lithography.
Combinations of these two materials are already being used successfully in the aerospace and nuclear industries, providing lower pollution and improved fuel economy for oil and gas combustion applications, and providing the ability to drill deeper wells faster for enhanced oil production. Transportation fields, including personal, commercial and military, and computers also rely on the combination of these materials.
The bonding wire is highly reliable with a strong tensile strength at room temperature and high temperatures, and a favorable bonding ability. When the bonding wire is looped, no rupture occurs in the ball neck region. Also, no chip cracking occurs since the ball is soft. This product will be available in different models and sizes, including CMOS, PIC and DIE microcontrollers’ circuit or computer processors.